IMS
High thermal performance PCBs used for discrete component Power Electronics applications and Power Lighting
IMS (Insulated Metal Substrate) PCBs can be manufactured with more than one layer.
Typical Multilayer IMS stack-up:
• Multilayer section - Electrical connections by means of blind vias
• Insulation layer - Thermal Conductivity up to 10 W/mK, Breakdown Voltage up to 11 kVAC
• Baseplate - aluminum or copper, thickness from 0.5 to 3.0 mm
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